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- 3M inikeza izixazululo ezintsha embonini ye-elekthronikhi futhi iyinhlangano ehamba phambili yezixazululo ze-interconnect for board-to-board, wire-to-board, backplane kanye nezicelo zokufaka / okuphumayo (I / O). Lokhu kufaka phakathi i-3M ™ Isixhumanisi se-Wiremount Insulation Displacement Contact (IDC), i-Mini Delta Ribbon (i-MDR) I-O System, i-mini-Clamp Wire Wire System, i-MetPak ™ High Speed Hard Metric (HSHM) kanye ne-Backplane entsha ye-Ultra Hard Metric (UHM) Izixhumanisi. Ukusebenzisa imboni ehamba phambili e-CAD - njenge-NX ™ kanye ne-SLA yokulinganisa - onjiniyela abanolwazi lwe-3M bavula imibono ibe yizixazululo zangempela zomhlaba.
I-3M inikeza izixazululo zokufakelwa kwebhodi lesifunda eliphrintiwe, umhlangano webhodi nokuhlolwa, njengamathelethi kanye namathonti, izinto ezixhunyiwe zikamasipala, Ukuhlolwa kwe-Textool ™ ne-Burn-in Amasokhethi, amathrekhi nezindwangu zokumboza namathreyi, izifunda eziguquguqukayo, nemikhiqizo yokunciphisa ukukhishwa kwamandla kagesi. I-3M iphinda inikeze izixazululo zokuzivikela kusuka ku-EMI / RFI, yokuphathwa okushisayo nokudonswa kwe-vibration, kanye nokupakisha nokulayishwa.
Ukuze uthole olunye ulwazi mayelana nokubandakanyeka kuka-3M embonini ye-elekthronikhi, vakashela ku-www.3M.com/electronics. Ukuze uthole izixazululo zokuxhumana, vakashela ku-www.3Mconnector.com.
I-3M, i-MetPak ne-Textool yizimpawu zokuthengisa ze-3M Inkampani. Ezinye izimpawu zokuthengisa ziyimpahla yabanikazi bazo.