Siphenya kahle iziqu zezikweletu zabathengisi, ukulawula ikhwalithi kusukela ekuqaleni. Sineqembu lethu le-QC, elingaqapha futhi lilawule ikhwalithi phakathi nenqubo yonke kufaka phakathi ukuza, ukugcina, nokulethwa.Zonke izingxenye ngaphambi kokuthunyelwa zizodluliselwa eMnyangweni wethu we-QC, sinikeza iwaranti yonyaka owodwa kuzo zonke izingxenye esizinikezile.
Ukuhlolwa kwethu kufaka:
- Ukuhlolwa Okubukwayo
- Ukuhlolwa Kwemisebenzi
- I-X-Ray
- Ukuhlolwa Solderability
- Ukuqedwa kokuqinisekiswa kwe-Die
Ukuhlolwa Okubukwayo
Ukusetshenziswa kwe-microscope ye-stereoscopic, ukubukeka kwezingxenye ze-360 ° ukubuka konke okuzungezile. Ukugxilwa kwesimo sokubuka kufaka ukufaka ukupakisha komkhiqizo; uhlobo lwe-chip, usuku, i-batch; ukuphrinta nokupakisha isimo; ukuhlelwa kwephini, i-coplanar nokufakwa kwecala nokunye.
Ukuhlola okubonakalayo kungaqonda ngokushesha imfuneko yokuhlangabezana nezidingo zangaphandle zabakhiqizi boqobo boqobo, amazinga we-anti-static kanye nomswakama, nokuthi asetshenzisiwe noma avuselelwe yini.
Ukuhlolwa Kwemisebenzi
Yonke imisebenzi namapharamitha ahloliwe, abizwa njengokuhlolwa kokusebenza okugcwele, ngokuya ngemininingwane yoqobo, amanothi wohlelo lokusebenza, noma indawo yokufaka iklayenti, ukusebenza okugcwele kwamadivayisi ahlolwe, kufaka phakathi nemingcele ye-DC yokuhlolwa, kepha akubandakanyi isici sepharamitha se-AC ukuhlaziywa nokuqinisekiswa kwengxenye yokuhlolwa okungekho ngobuningi imikhawulo yamapharamitha.
I-X-Ray
Ukuhlolwa kwe-X-ray, ukuhamba kwezingxenye ngaphakathi kokubukwa okuzungezile okungu-360 °, ukuthola isakhiwo sangaphakathi sezinto ezingaphansi kwesimo sokuhlolwa nesixhumi sephakheji, ungabona inani elikhulu lamasampuli ngaphansi kokuhlolwa liyafana, noma ingxube (Mixed-Up) kuvela izinkinga; ngaphezu kwalokho banemininingwane (iDatasheet) komunye nomunye kunokuqonda ukulunga kwesampula ngaphansi kokuhlolwa. Isimo sokuxhuma kwephakheji yokuhlola, ukuze ufunde ngokuxhumeka kwe-chip nephakeji phakathi kwezikhonkwane kuyinto ejwayelekile, ukukhipha ukhiye nocingo oluvulekile olufushane.
Ukuhlolwa Solderability
Le akuyona indlela yokuthola inkohliso njengoba i-oxidation ivela ngokwemvelo; kodwa-ke, ingudaba olubalulekile ekusebenzeni futhi luvame kakhulu ezindaweni ezishisayo, ezinomswakama njengaseNingizimu-mpumalanga ye-Asia kanye nasezifundazweni eziseningizimu eNyakatho Melika. Izinga elihlanganisiwe le-J-STD-002 lichaza izindlela zokuhlola futhi lamukele / linqabe imibandela ye-thru-hole, surface mount, kanye namadivayisi we-BGA. Kumadivayisi we-surface we-non-BGA, i-dip-and-look iyaqashwa futhi i- "ceramic plate test" yamadivayisi we-BGA isanda kufakwa kuhlelo lwethu lwezinsizakalo. Amadivayisi alethwa emaphaketheni angafanele, ukupakisha okwamukelekayo kepha angaphezu konyaka owodwa ubudala, noma okukhombisa ukungcola ezikhonkwaneni kunconyelwa ukuhlolwa kwe-solderability.
Ukuqedwa kokuqinisekiswa kwe-Die
Isivivinyo esonakalisayo esisusa okokufaka kwento ukuveza okokufa. I-die bese ihlaziywa ukumakwa nokwakhiwa kwayo ukuthola ukulandeleka nobuqiniso bedivayisi. Amandla okukhulisa afinyelela ku-1,000x ayadingeka ukukhomba ukumakwa kokufa kanye nokungahleleki okungaphezulu.
